Gesswein’s Standard Soluble diamond compound has an oil soluble carrier that holds the compound together even under high-speed applications. The carrier helps provide faster cutting action and can be thinned with lubricant/thinner. These compounds feature close tolerances on particle size and distribution for consistency. The diamond concentration has been specifically designed for the mold & die industry.
Paul H. Gesswein & Co. Inc.
Bridgeport, Connecticut
phone: 888-480-5811
www.gesswein.com
